| Name | Type | Chemical composition | Application |
| Tin with lead | Sn60Pb40 (LC60) | 60% Sn / 40% Pb | Soldering of electronics |
| Tin with lead | Sn63Pb37 (LC63) | 63% Sn / 37% Pb (eutectic) | Soldering of electronics |
| Tin with lead | Sn50Pb50 (LC50) | 50% Sn / 50% Pb | General soldering, sheet metal, gutters, water installations, electronics |
| Tin with lead | Sn40Pb60 (LC40) | 40% Sn / 60% Pb | Larger components, thicker cables |
| Tin with lead | Sn30Pb70 (LC30) | 30% Sn / 70% Pb | Heavier connections, hydraulics |
| Tin with lead | Sn10Pb90 (LC10) | 10% Sn / 90% Pb | Soldering of pipes and sheets in older systems |
| Tin bearing alloys | Babbitt tin alloy I | Sn 90% / Sb 7% / Cu 3% | Heavy-duty plain bearings |
| Tin bearing alloys | Babbitt tin alloy II | Sn 89% / Sb 8% / Cu 3% | Plain bearings, medium load bearing, good lexibility |
| Tin bearing alloys | Babbitt tin alloy III | Sn 83% / Sb 10% / Cu 7% | Plain bearings - more wear-resistant |
| Tin bearing alloys | Ł80 | Sn ~80%, Sb ~10%, Cu ~10% | Industrial machinery bearings |
| Tin bearing alloys | Ł83 | Sn ~83%, Sb ~11%, Cu ~6% | Turbine, compressor bearings |
| Tin bearing alloys | Ł89 | Sn ~89%, Sb ~7%, Cu ~4% | Plain bearing shells |
| Tin bearing alloys | Ł93 | Sn ~93%, Sb ~4%, Cu ~3% | Slide bearing shells - high corrosion and temperature resistance |
| Tin with copper | Sn99Cu1 | Sn 99% / Cu 1% | Lead-free solder, water systems, radiators |
| Tin with copper | Sn99.3Cu0.7 | Sn 99.3% / Cu 0.7% | Soldering electronics - a very popular lead-free binder |
| Tin with copper | Sn97Cu3 | Sn 97% / Cu 3% | For soldering larger components such as pipes, radiators |
| Tin with copper | SnCu0.5 | Sn 99.5% / Cu 0.5% | Soldering of electronics - less common |
| Tin with copper | SnCuNi | Sn 99% / Cu 0.7% / Ni traces | Lead-free electronics with nickel addition for weld stabilisation |
| Tin with silver | Sn97Ag3 | Sn 97% / Ag 3% | Stronger connections; electronics and fine mechanics |
| Tin with silver | Sn97Ag4 | Sn 97% / Ag 4% | Stronger connections; electronics and fine mechanics |
| Tin with silver | SnAgCu | Sn 97% / Ag 4% | Soldering of electronics |
| Tin with silver | SAC300 | Sn 97% / Ag 4% / Cu 0.0% | Soldering of electronics - Low-silver/microalloyed, thermal break restriction |
| Tin with silver | SAC305 | Sn 96.5% / Ag 3% / Cu 0.5% | Soldering of electronics - industry standard, high strength |
| Tin with silver | SAC405 | Sn 95.5% / Ag 4% / Cu 0.5% | Soldering of electronics - higher strength, more expensive, for demanding applications |
| Tin with silver | SAC387 | Sn 95.8% / Ag 3.8% / Cu 0.7% | Soldering electronics - a balance between cost and performance |
| Tin with silver | SAC0307 | Sn 99% / Ag 0.3% / Cu 0.7% | Soldering of electronics - minimal silver, economical binder |
| Tin with silver | SAC105 | Sn 98.5% / Ag 1% / Cu 0.5% | Soldering of electronics - cheaper, compromise between performance and price |
| Tin with silver | SACX | Sn ~99% / Ag 0.3-0.5% / Cu 0.7% + additives | Soldering of electronics - low-silver version with micro-alloys (Ni, Ge) crack-resistant |
| Tin with silver | SAC257 | Sn 97.5% / Ag 2.5% / Cu 0.7% | Electronics soldering - less common, but used in some applications. Crack resistant |
| Tin with silver | SACM | Sn 98.7% / Ag 0.3% / Cu 0.7% + Mn | Soldering of electronics - contains manganese (Mn) to reduce cracking and |
| Tinware | min. 80% Sn | |
